Localization of component lead inside a THT solder joint for solder defects classification Journal title: Journal of Achievements in Materials and Manufacturing Engineering Authors: C.L.S.C. Fonseka, J.A.K.S. Jayasinghe Subject(s): Engineering
Feature Extraction and Template Matching Algorithms Classification for PCB Fiducial Verification Journal title: Journal of Achievements in Materials and Manufacturing Engineering Authors: Sameera Fonseka, J.A.K.S Jayasinghe Subject(s): Engineering