MICROSTRUCTURE AND MECHANICAL PROPERTIES DEGRADATION OF CrMo CREEP RESISTANT STEEL OPERATING UNDER CREEP CONDITIONS Journal title: Materials Engineering - Materialove inzinierstvo (MEMI) Authors: Ján Micheľ, Marián Buršák, Marek Vojtko Subject(s):
Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders Journal title: JOURNAL OF ADVANCES IN PHYSICS Authors: Amal Mohamed Yassin, Reda Ismail Afify, Berlent Khalifa Subject(s):
Investigation of Microstructure and Creep Properties of Sn-xSb Solder Alloys up to Peritectic Composition Journal title: JOURNAL OF ADVANCES IN PHYSICS Authors: Amal Mohamed Yassin, Berlent Khalifa, Reda Ismail Subject(s):
