The Evolution of Microprocessor Chip: A historic overview of development Journal title: International Journal of Science Engineering and Advance Technology Authors: Waqar Ahmad Jang| Department of Computer Science, Abdul Wali Khan UniversityMardan, KPK, Pakistan, W... Subject(s): Engineering, Medicine, Social Sciences, Pharmacy
slugPollution threat to surface and ground water quality due to electroplating units Journal title: International Journal for Research in Applied Science and Engineering Technology (IJRASET) Authors: R. K. Singh Subject(s): Engineering, Applied Linguistics
THE EFFECT OF ELECTRIC FLOW ON DECORATIVE KROM ELECTROPLATING WITH COPPER BASE METAL TOWARD CORROSION RATE Journal title: Prisma Sains: Jurnal Pengkajian Ilmu dan Pembelajaran Matematika dan IPA IKIP Mataram Authors: Ahmadi Ahmadi, Citra Ayu Dewi Subject(s): Education, Science Education
Chromium removal and water recycling from electroplating wastewater through direct osmosis: Modeling and optimization by response surface methodology Journal title: Environmental Health Engineering and Management Journal Authors: Zohreh Naghdali1,2 , Soleyman Sahebi3 , Reza Ghanbari4,2 , Milad Mousazadeh1,2 , Hamzeh Ali Jamali... Subject(s): Environmental Sciences, Environmental Economics, Environmental Engineering
Effect of Some Process Variables on Nickel Electroplating of Low Carbon Steel Journal title: Leonardo Electronic Journal of Practices and Technologies Authors: OLORUNTOBA Daniel, EGHWUBARE Oghenedoro, OLUWOLE Oluleke Subject(s):
EVALUATION OF SOME NEW ORGANIC ADDITIVES WITH ALTERNATIVE FUNCTION GROUPS IN CYANIDE-FREE ALKALINE ZINC ELECTROPLATING Journal title: Journal of Science And Arts Authors: ABD EL-SHAFEY AHMED, ABDELFATTAH SHAABAN Subject(s): Chemistry, Mathematics, Physics, Analytical Chemistry, Inorganic Chemistry, Organic Chemistry, Physical Chemistry, Nuclear Physics, Science
CRYSTALLINITY ANALYSIS OF COMPOSITE COATING ON Al SUBSTRATE BY ELECTROPLATING METHOD Journal title: International Journal of Engineering Sciences & Research Technology Authors: D. Manikandan , R.Muraliraja , R. Dhinakaran , Dr. A. Kalaisselvane Subject(s):
Speciation of heavy metals in electroplating industry sludge and wastewater residue using inductively coupled plasma<br /> Journal title: International Journal of Environmental Science and Technology Authors: P. Venkateswaran, S. Vellaichamy, K. Palanivelu Subject(s):
PENGARUH VARIASI KUAT ARUS LISTRIK DAN WAKTU PROSES ELECTROPLATING TERHADAP KEKUATAN TARIK, KEKERASAN DAN KETEBALAN LAPISAN PADA BAJA KARBON RENDAH DENGAN KROM Journal title: Dinamika Teknik Mesin Authors: Subject(s):
Recovery of nickel and copper from metal finishing hydroxide sludge by kinetic acid leaching Journal title: Journal of New technology and Materials Authors: R. salhi, M. Boudjouada, S. Messikh, N. Gherraf Subject(s): Technology, Chemical sciences, Physical sciences
CHANGES IN THE STRENGTH OF THE POLYMER CONCRETE USED IN THE ELECTROPLATING VATS UNDER OPERATIONAL LOAD Journal title: Civil and Environmental Engineering Reports Authors: Lidia RADNA, Volodymyr SAKHAROV Subject(s):
High Hardness Nickel - Carbon Nanotubes Composite Electroplating Journal title: Advances in Research Authors: Bui Hung Thang, Nguyen Xuan Toan, Phan Ngoc Minh Subject(s):
Recovery of Chromium from Electroplating Wastes by Solvent Extraction Journal title: Journal of Chemical Engineering & Process Technology Authors: Abbas Hadi Al-Shukrawi, Dhuha H Fadhel, Alaa Adnan Rashad, Nariman Hussain Al-Alamy Subject(s): Thermodynamics, Engineering, Chemical, Polymer Science, Electrochemistry
Development of new technological solutions for recovery of heavy nonferrous metals from technogenic waste of electroplating plants and sludge of water treatment systems Journal title: Восточно-Европейский журнал передовых технологий Authors: Mikhail Barkan, Anton Kornev Subject(s):
STUDIES ON IMPACT OF ZINC ELECTROPLATING INDUSTRIAL EFFLUENT ON HEMATOLOGY AND BIOCHEMICAL PARAMETERS OF CYPRINUS CARPIO Journal title: IJAR-Indian Journal of Applied Research Authors: P. Ramachandran, M.R. Rajan Subject(s):