ANALYSIS AND VERIFICATION OF INTEGRATED CIRCUIT THERMAL PARAMETERS
Journal Title: Informatyka Automatyka Pomiary w Gospodarce i Ochronie Środowiska - Year 2014, Vol 4, Issue 4
Abstract
The paper describes thermal model of an ASIC designed and fabricated in CMOS 0.7 m (5 V) technology. The integrated circuit consistsof analogue and digital heat sources and some temperature sensors. It has been designed to carry out some thermal tests. During tests thermal resistances, capacities, time constants and convection coefficients for different packages, positions and cooling methods were extracted. The parameters of thermal model were used in simulation to compare results with real-world measurements.
Authors and Affiliations
Maciej Frankiewicz, Adam Gołda, Andrzej Kos
Keywords
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