Basic research of thermal transfer simulations
Journal Title: Proceedings in Manufacturing Systems - Year 2016, Vol 11, Issue 1
Abstract
The article summarizes basic research into thermal transfer simulations. Problems of thermal influence in mechanical systems are solved there. The first steps focus on matching simple heat-transfer samples with CAE software. Simple cases are performed in a real environment. Thermal values are measured. Cases are also solved using CAE software tools. Solutions are compared. CAE solutions are matched to real values. CAE results are verified or refuted. There are many differences between the options in the solvers, there are steady states and transient-run possibilities, etc. Software tools like Nastran, etc. need many coefficients to solve the problem. This procedure is able to identify specific conditions, fits the solver to the specific sample and performs CAE simulations to get real, verified results. For example, passive radiators heated by an induction heater are used for real tests. Temperature fields are measured by thermal camera and structural deformations by measuring displacement. These values are used in simulations and solved by finite elements method. Simulations are performed in Siemens NX10 software, supported by solvers Nastran, MAYA, and NX Multiphysics. Results are compared and matched in the simulation to acquire a more precise solution in the following steps All these steps are processed to get characteristics of thermal transfer simulation which will be useful in difficult examples of simulation machines, machine tools etc.
Authors and Affiliations
Vaclav Marek
Keywords
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