Abstract

The improvement of heat transfer has necessitated engineering work in the field of electronic devices cooling. In order to achieve device performance and reliability in the direction of these improvements, there is a need of thermal management strategies. Generally, two types of heat sink geometries are used for electronic equipment cooling. These are plate-fin heat sinks and pin-fin heat sinks. Depending on the area of use, the pin types have superiority to each other. However, it is possible to design a suitable geometry can be combined. The cooling performances of heat sinks for different fin types are compared with each other with the Fluent, computational fluid dynamics software, in the study. The heat sinks have the same surface area are modelled for all cases. The heat flux 1000 W · mm-2 is defined on 104 mm x 104 mm plate surface and the diameter of pins and width of plates used as fin are 4.06 mm for heat sinks. Temperature distribution contours and flow velocities used for comparison of cooling performances of heat sinks are obtained. The temperature of heat sinks stays under 45 oC. It can be said that

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