Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
Journal Title: Frattura ed Integrità Strutturale - Year 2011, Vol 5, Issue 15
Abstract
The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance of the boards in their application lifetime, different tests were developed. The current industry-wide standard testing method is a board level drop test. In this test, the boards are dropped under defined conditions until a failure in the board is detected. The main failure driver is a flexural oscillation of the board due to the impact event. As this test method has a number of drawbacks, an alternative test method was evaluated in this study. A board level cyclic bend test was used and the results of both tests were compared. A very good correlation between the methods could be observed, supporting the suitability of the board level cyclic bend test for the determination of the drop test performance. The advantages of the alternative test method were shorter testing times, better adaptability and test simulations at lower computing time. In future analysis, test simulations will be used to generate Wöhler curves related to the local stresses.
Authors and Affiliations
P. F. Fuchs, Z. Major
Keywords
Related Articles
- EP ID EP113835
- DOI 10.3221/IGF-ESIS.15.07
- Views 26
- Downloads 0
EBSD-assisted fractographic analysis of crack paths in magnesium alloy
Magnesium (Mg) alloys are attractive as structural materials due to their light weight and high specific strength. It is well known that Mg alloy has hexagonal close-packed (HCP) structure and only basal slip ...
Fracture toughness of TiAl-Cr-Nb-Mo alloys produced via centrifugal casting
Fracture toughness of a TiAl base intermetallic alloy has been investigated at room temperature. The Ti-48Al-2.5Cr-0.5Nb-2Mo (at. %) alloy produced via centrifugal casting exhibits fine nearly lamellar microstructu...
Paths of interactive cracks in creep conditions
The paper contains plane strain analysis of uniformly stretched plate working in creep condition. The plate contains initial defects in forms of central and/or edge cracks working in mode I. These cracks are ...
Mechanism of crack branching in the fatigue crack growth path of 2324-T39 Aluminium alloy
The crack growth behavior in 2324-T39 aluminium alloy was experimentally investigated. Two types of crack branching were observed. The mechanism of an uncommon crack branching which results from the link up o...
A 3D mixed frame element with multi-axial couplingfor thin-walled structures with damage
A 3D mixed beam finite element is presented, modeling the warping of the cross-sections as anindependent kinematic field. The beam formulation is derived on the basis of the Hu-Washizu variationalprinciple, express...