Effect of Temperature on Cu-doped p-ZnTe Thin-Films
Journal Title: JOURNAL OF ADVANCES IN PHYSICS - Year 0, Vol 10, Issue 1
Abstract
In this paper we study the effect of temperature in 150 (±5) and 80 (±5) nm p-ZnTe thin- films immersed in 60 mgCu(NO3)2-3H2O/150 ml (H2O) for 1 minute, and heated at 200 and 300 °C for 30 minutes. Active layers were deposited by pulsed-laser deposition (PLD) at room temperature. Electrical parameters in un-doped films were around 108 ?109 ? and these values decreased to ~ 103 ? when the films were immersed in a Cu solution. The Cu-doped samples heated at 300 °C showed a completely homogeneous doping. X-ray diffraction (XRD) patterns showed the orthorhombic structure at 200 and 300 °C.
Authors and Affiliations
G. Lastra, A. Olivas, J. I. MejÃa, M. A. Quevedo-López
Green synthesis of mixed metallic nanoparticles using room temperature self-assembly
Bimetallic nanoparticles of silver (Ag) and gold (Au) were synthesized at room temperature using Curcumin. Reduction process of silver and gold ions with different molar ratios leads to production of different nanostruct...
Approximate Analytical Solution of Magnetohydrodynamics Compressible Boundary Layer flow with Pressure Gradient and suction/injection
The aim of this work is to obtain exact analytical solution to the two dimensional laminar compressible boundary layer flow with an adverse pressure gradient in the presence of heat and mass transfer with MHD. The method...
Structural and Magnetic Properties of Co0.5Ni0.5-xMnxFe2O4(x=0, 0.15, 0.25, 0.35, 0.5) Ferrite Nanoparticles Prepared via Sol-Gel Auto-Combustion Method
In this study, Co0.5Ni0.5-xMnxFe2O4 (x=0, 0.15, 0.25, 0.35, 0.5) ferrite nanoparticles were prepared by sol-gel auto-combustion method. Structural, magnetic and morphology properties of obtained nanoparticles were invest...
Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.
The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu s...
Entanglement Explained by Sequencing Satisfies Lack of Trajectory and The Holographic Principle
The implications of entanglement have scared many, but if we use all we understand about existence sequencing is probably the answer given probable experiments that we should have the technology to do within the next 5 y...