Embedding of Internal and External Components of Cochlear Implant on to a Single Integrated Circuit
Journal Title: IOSR Journals (IOSR Journal of Computer Engineering) - Year 2016, Vol 18, Issue 4
Abstract
Abstract: The Latest Cochlear Implant Naida CI Q70 With Advanced Wireless Feature Has Got Its Speech Processor And Transmitter In The Form Of Reliable Wire Communication Architecture. This Architecture Creates Problem For Deaf In Terms Of Maintenance And Cost For Its Complex Structure. The External Components Such As Transmitter, Sound Processor And Its Internal Components And Microphones Are Apart In Structure Both Internally And Externally. The Communication Among The External Devices Requires APhysical Wire, And This Structure Has Many Disadvantages One Is It Needs A Lot Of Care To Maintain And On Any Small Damage Requires Huge Money Needs To Be Spent On New Head Piece. Secondly Its Rare And Unique Structure Creates A Lot Of Nuisance With Multiple Enquiries From The People Leading To TheFrustration While Answering Many People. Hence The Idea Is To Design A Circuit That Accommodates All Internal And External Components On To Single IC. This Technology Development Is To Provide Technological Solutions With Multidisciplinary Approach To Resolve The Problems And Improve Quality Of Life Of The Deaf Population (Specifically Deaf Children’s) With Focused Initiative On Technology Interventions Which Leads Commercial Product, Also Aim In Providing Individual Autonomy And Independence To Persons With Deaf Through Holistic Development By Creating Enabling Environment For Their Empowerment Through Application Of Technology.
Authors and Affiliations
Dr. Ramesh K, Deepa Patil
Keywords
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