HEAT TRANSFER IN THE COOLER - CPU INTERFACE
Journal Title: TEHNOMUS - Year 2013, Vol 20, Issue 1
Abstract
The increased number of requests regarding the cooling of the computers and the miniaturization of electronic components, determined the search for new solutions for intensifying the heat exchange between the processor and the heat sink, the link between these two being realized by means of a thermoconducting paste. The current article aims to realize a brief presentation of the concerns regarding the improvement of heat exchange in the CPU –heat sink interface. In the second part, it is realized a calculation method of thermal transfer through TIM, highlighting the presence of some inhomogeneities and gaps in TIM, determining a rise of temperature. The model is used and validated by comparison with numerical results obtained by authors in specialized literature.
Authors and Affiliations
Pătuleanu Liliana, Andronic Florin, Manolache-Rusu Ioan-Cozmin, Radion Ivan
Keywords
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