Investigation and Optimization of Heat Removal from a Micro-Processor Using Solid Works 2013 and Ansysy Workbench
Journal Title: Scholars Journal of Engineering and Technology - Year 2016, Vol 4, Issue 9
Abstract
Abstract:The global warming increase especially in the tropical regions like west Africa countries like Nigeria calls fall optimization of heat removal system to avoid regular failure of electronics for repairs or permanent damage. Microprocessors work best at low temperatures, the need to condition its ambient condition at low temperatures at minimum of (29 -38)0c is necessary. The effective efficiency and performance of an electronic Circuit is an electronic appliance depends on the condition of its environment. Most electronic components do not function best under high temperatures as their performance is inversely proportional to temperature increase. The use of external fans to cool electronics when in use is energy and cost sapping. Hence, this paper tends to design and optimize heat removal rate from a microprocessor using heat tube and cooling fins incorporated with a high power suction fan of 0.75watt with 40x40x1.5 fins, increase in surface area, number of fins and suction speed of the fan are parametric factors that improve rate of heat removal. Designed and developed with solidworks 2013 and Ansys Work Benchmultiphysics, results show a directional heat flux 2.8117×〖10〗^6 W⁄m^2 and a total heat flux of 5.7828×〖10〗^6 W⁄m^6 in the system. Keywords:Heat Removal rate optimization; Heat Tube, Cooling Fins, Suction Fan and Micro Processor
Authors and Affiliations
Ejehson Philip Sule, Asha Saturday, Erukpe Aluhumile Peter, Joseph Micheal Irabodemeh, Imah Friday
Keywords
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