Investigation the electrical properties of copper films for integrated circuits
Journal Title: Вісник НТУУ КПІ. Серія Радіотехніка, Радіоапаратобудування - Year 2010, Vol 0, Issue 43
Abstract
A comprehensive investigation of the microstructure, electrical and mechanical parameters of copper films obtained thermionic application (TIA) on the glass-ceramic substrate and polycore. The studied parameters were compared with the corresponding parameters of granules fused in a vacuum of copper, of which had been made the studied samples. Studies have shown that the main parameters of copper technology with TIA, close to the values of bulk samples fused in a vacuum of copper.
Authors and Affiliations
M. Prischepa
Keywords
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- EP ID EP309504
- DOI 10.20535/RADAP.2010.43.51-59
- Views 32
- Downloads 0
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