Isothermal section of the Ho–Cu–Sn ternary system at 670 K
Journal Title: Фізика і хімія твердого тіла - Year 2018, Vol 19, Issue 2
Abstract
The interaction of the components in the Ho-Cu-Sn ternary system was investigated at 670 K over the whole concentration range using X-ray diffraction and EPM analyses. Four ternary compounds were formed in the Ho–Cu–Sn system at 670 K: HoCuSn (LiGaGe type, space group P63mc), Ho3Cu4Sn4 (Gd3Cu4Ge4-type, space group Immm), HoCu5Sn (CeCu5Au-type, space group Pnma), and Ho1.9Cu9.2Sn2.8 (Dy1.9Cu9.2Sn2.8-type, space group P63/mmc). The formation of the interstitial solid solution based on HoSn2 (ZrSi2-type) binary compound up to 5 at. % Cu was found.
Authors and Affiliations
L. Romaka, I. Romaniv, V. V. Romaka, M. Konyk, A. Horyn, Yu. Stadnyk
Keywords
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- EP ID EP411348
- DOI 10.15330/pcss.19.2.139-146
- Views 56
- Downloads 0
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