Mechanical Behaviour of Silicon and Quartz under Various Loading/Unloading Conditions by Using Nano-Indentation Technique
Journal Title: International Journal for Research in Applied Science and Engineering Technology (IJRASET) - Year 2016, Vol 4, Issue 12
Abstract
The following experimental work was performed to check the various mechanical properties of silicon as well as that of quartz by using the nanoindentation technique. A Berkovich indenter was used for this purpose. The surface Young’s modulus (E) and hardness (H) of fused quartz and that of silicon substrate samples have been studied by nanoindentation. Two factors strongly affect the results of E and H. One factor is the polishing quality of the silicon substrate surface. Poor polishing quality produces much smaller E and H than the literature values for bulk fused silica. The second factor is surface flatness. So the H and E are plotted by the help of plot between loads and displacements. The mean contact pressure or the hardness was determined from a measure of the contact depth of penetration (hc). A maximum hardness (H) or mean contact pressure value of 8.2 GPa was found at 37 and 64 nm depths in case of silicon. A maximum hardness value of about 6.3 GPa was found at 37 and 64 nm depths, in case of quartz. Smaller indentation depths in Si were found than that in quartz, for each applied loads. This was because Young’s modulus and the hardness of Si were higher than that of quartz.
Authors and Affiliations
Sunil Kumar, Dharampal Dehal , Hartaj Singh, Vishal Singh, Ankit Dogra
Keywords
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