A comparative study of Mixed CNT bundle with Copper for VLSI Interconnect at 32nm
Journal Title: INTERNATIONAL JOURNAL OF ENGINEERING TRENDS AND TECHNOLOGY - Year 2013, Vol 4, Issue 4
Abstract
The aggressive technology scaling in VLSI leads to decrease the size of chip. Such continual miniaturization of VLSI devices has strong impact on the VLSI technology in several ways. The performance of ICs have been increased and the interconnect delay becomes much more significant. Copper interconnects have become a significant performance limiter. Thus to overcome from the limitation of copper Carbon Nanotubes have been proposed as a possible replacement of copper interconnect. Several different configuration of CNT have been proposed out of which Mixed CNT configuration have received much attention for their unique characteristics and as a possible alternative to Cu interconnects in future ICs. In this paper we have compare the Mixed CNT interconnect configurations with copper interconnect. For the first time a compact equivalent circuit model of Mixed CNTs is presented, and the performance of Mixed CNT interconnects is evaluated and compared against traditional Cu interconnects at various parameters
Authors and Affiliations
Tarun Parihar#1 , Abhilasha Sharma
Keywords
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