Numerical Analysis of Temperature Depression in A Multi-Fin Array
Journal Title: Scholars Journal of Engineering and Technology - Year 2017, Vol 5, Issue 10
Abstract
The purpose of the present study is to analyze two-dimensional heat transfer analysis in arrayed fins with thermal dissipation. The heat conduction equation for the multi-fin array is solved employing finite element method with the convective boundary conditions. The finite element analysis can conveniently solve complex multi fin array assembly. Furthermore, the present study will also discuss the effects of dimensions of the fin assembly, heat transfer coefficient, material of the fin on the temperature distribution in the fin. A numerical analysis is carried out to determine the temperature depression caused by multi-fin array attached to the base plate. It is found that the temperature depression is a function of convective heat transfer coefficient, geometry of fin and fin material. Optimization of the fin geometry can reduce the temperature depression in the fin array. Keywords:Convection, heat transfer, extended surface, fin array, temperature depression
Authors and Affiliations
R. C. Mehta
Keywords
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