Abstract

Based on the simplified two-dimensional heat and hydrodynamics models we estimate an optimal thickness of the wick layer that should be sintered inside the flat plate heat pipe to provide its maximum operating performance, namely, high capillary limit and low temperature of cooled microelectronic components. External walls of the heat pipe assumed to be non-adiabatic and free convection conditions are used in the model. Assumptions of laminar gas flow in the vapor core and Darcy’s model for liquid flow in the wick are utilized. It is shown that a strong maximum of the heat pipe total heat transfer capability can be achieved by choosing the optimal value of the wick layer thickness. The possibility of the heat pipe total thickness reduction is also investigated for fixed properties and microstructure of the wick.

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