Optimization of Working of Processor by Fins Using FEM
Journal Title: International Journal for Research in Applied Science and Engineering Technology (IJRASET) - Year 2014, Vol 2, Issue 8
Abstract
In the present study, thermal analysis of electronic processor is proposed and an effort is made to decrease the maximum temperature in processor by employing straight rectangular fins which aid in rapid heat removal to the surroundings for ensuring the optimal working of the processor. Heat is generated in the processor and Heat removal is augmented by the application of fins to it. Comparative study is presented by selecting Silicon and Copper material for electronic processor, rectangular in shape enclosed by a steel casing and to it aluminum fins are attached. Modeling and Analysis carried out using Finite Element Method (FEM) based software, ANSYS APDL. Heat flows out from the processor to the surrounding through the casing and then fins attached to it. Convective boundary condition is applied to the casing and fins except the bottom which is insulated. Increase in number of fins leads to decrease in maximum temperature and increase in heat flux of the processor proportionally. The results report the temperature distribution and heat flux contour for different selection in number of fins. Conclusion are drawn from results pertaining using the appropriate number of fins to be used to optimize the maximum temperature in processor. Results show that ANSYS APDL can be used effectively and efficiently to solve challenging heat transfer problem. His document gives formatting instructions for authors preparing papers for publication in the Proceedings of an IEEE conference.The authors must follow the instructions given in the document for the papers to be published. You can use this document as both an instruction set and as a template into which you can type your own text.
Authors and Affiliations
M. Bisht, K. S. Mehra
Keywords
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