THERMAL ANALYSIS OF PRINTED CIRCUIT BOARD (PCB) OF AVIONICS EQUIPMENT
Journal Title: International Journal of Advanced Research in Computer Engineering & Technology(IJARCET) - Year 2012, Vol 1, Issue 6
Abstract
As the power requirements of advanced aircrafts steadily move towards higher density and higher heat loads, Requirements of thermal analysis for advanced avionics are becoming more severe and critical to avionics design year after year. So increasing the power densities in compact electronic systems or in high density packages has escalated the need for proper thermal analysis. Power electronics devices for future advanced aircrafts require higher performance at the same time more compactness. Though this trends a great increment of the power density per square inch of PCB’s, the operating temperature of most of the devices is still settled below 125OC. An accurate prediction of the junction temperature of components is necessary for confidence in their reliability and performance. The task of thermal designer of an electronic system is to design a cooling system that will keep the junction temperature of the key components below a prescribed value. Since this usually involves a number of iterations the designer therefore relies heavily on analytical tools to predict the critical temperatures. In this paper , thermal behavior of highly heat dissipating components, temperature distribution on the board, Junction temperature are to be analyzed using PCB thermal analysis software, taking total heat dissipation of components, board properties, grounding and metal core properties into consideration. With these analysis results we can foresee any problem arising due to inadequate provision for heat dissipation resulting in poor performance & reliability and ultimately failure of the components and equipment.
Authors and Affiliations
Dr. N. V. Srinivasulu
Keywords
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