Trend Analysis of Interconnect System for Integrated Circuit
Journal Title: International Journal of Electronics Communication and Computer Engineering - Year 2018, Vol 9, Issue 1
Abstract
In order to study the status and trend of the interconnect system, a synthetic investigation from the development of interconnect material to structure and hierarchy are given. Therefore, according the detailed trend analysis, the new interconnect prospect and challenge have been posed at great length. All these can help the new researchers to understand the present situation of interconnect system.
Authors and Affiliations
Qian Lin, et al.
Keywords
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