A comparative study of Mixed CNT bundle with Copper for VLSI Interconnect at 32nm Journal title: INTERNATIONAL JOURNAL OF ENGINEERING TRENDS AND TECHNOLOGY Authors: Tarun Parihar#1 , Abhilasha Sharma Subject(s):
ANALISIS KADAR TIMBAL (Pb), SENG (Zn) DAN TEMBAGA (Cu) PADA IKAN BANDENG (Chanos chanos Forsk.) YANG BERASAL DARI LABBAKKANG KAB. PANGKEP SECARA SPEKTROFOTOMETRI SERAPAN ATOM (SSA) Journal title: As-Syifaa Jurnal Farmasi Authors: Azizah Zulfiah, Seniwati Seniwati, Sukmawati Sukmawati Subject(s):
The Effect of Sintering Temperature on Graphene Oxide Reinforced Copper Matrix Composite Fabricated Through Powder Metallurgy Technique Journal title: Engineering and Technology Journal Authors: Dr. M. Maruthi Rao, Nandam Venkata Karthikeya, Shaik Mahaboob Basha,S. Sravan Raghav, Akyam Jaswanth... Subject(s): Engineering, Technology
