Characterization of Indium addition on Sn-Bi-Sb Lead free Solder alloy Journal title: JOURNAL OF ADVANCES IN PHYSICS Authors: Sara Mosaad Mahlab, Mustafa Kamal, Abd El-Raouf mohamed Mansour Subject(s):
Metallographic study of Sn-Bi-Sb-In alloy prepared by rapid solidification Journal title: JOURNAL OF ADVANCES IN PHYSICS Authors: Sara Mosaad Mahlab, Mustafa Kamal, Abd el-raouf Mohamed Subject(s):
Microstructural analysis for Sn-Bi-Sb-In alloy prepared by rapid solidification Journal title: JOURNAL OF ADVANCES IN PHYSICS Authors: Sara Mosaad Mahlab, Mustafa Kamal, Abd El-Raouf Mansour Subject(s):
Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders Journal title: JOURNAL OF ADVANCES IN PHYSICS Authors: Amal Mohamed Yassin, Reda Ismail Afify, Berlent Khalifa Subject(s):
Modification in Bi-Ag Lead-Free Solder-Bearing Alloying Elements Journal title: JOURNAL OF ADVANCES IN PHYSICS Authors: Rizk Mostafa Shalaby, Musaeed Allzeleh, Mustafa Kamal Subject(s):
Effect of Terbium Additions on Microstructural, Thermal and Mechanical Properties of Eutectic Sn-3.5Ag Pb- Free Solder for Low Cost Electronic Assembly Journal title: JOURNAL OF ADVANCES IN PHYSICS Authors: Rizk Mostafa Shalaby, Fatma Elzahraa Ibrahim, Mostafa Kamal Subject(s):
Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt. Journal title: JOURNAL OF ADVANCES IN PHYSICS Authors: Rizk Mostafa Shalaby, Mohamed Munther, Abu-Bakr Al-Bidawi, Mustafa Kamal Subject(s):
