A simple beam model to analyse the durability of adhesively bondedtile floorings in presence of shrinkage
Journal Title: Frattura ed Integrità Strutturale - Year 2014, Vol 8, Issue 29
Abstract
A simple beam model for the evaluation of tile debonding due to substrate shrinkage is presented.The tile-adhesive-substrate package is modeled as an Euler-Bernoulli beam laying on a two-layer elasticfoundation. An effective discrete model for inter-tile grouting is introduced with the aim of modellingworkmanship defects due to partial filled groutings. The model is validated using the results of a 2D FE model.Different defect configurations and adhesive typologies are analysed, focusing the attention on the prediction ofnormal stresses in the adhesive layer under the assumption of Mode I failure of the adhesive.
Authors and Affiliations
S. De Miranda, A. Palermo, F. Umbertini
Keywords
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- EP ID EP88632
- DOI 10.3221/IGF-ESIS.29.25
- Views 114
- Downloads 0
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