Fabrication and Characterization of Low-Temperature Conductive Film Bonded Crystalline Silicon Solar Cells and PV Modules
Journal Title: International Journal of Engineering Sciences & Research Technology - Year 2014, Vol 3, Issue 12
Abstract
Low-temperature conductive films (LT-CFs) were examined as a bonding material for fabricating a solar cell string. Morphological, mechanical, and electrical contact properties of the LT-CFs and solar cells bonded using them under various conditions were carefully evaluated. In particular, a value combining all sample bonding parameters, VBP (VBP = temperature (°C) × pressure (MPa) × time (h)), was introduced.On the basis of the results obtained, the parameter range was divided into three regimes: soft, moderate, and hard regime. The moderate regime was corresponded to strong bonding and low power loss. LT-CF-bonded cells in this regime showed a compression rate of 39.7–45.0 % corresponding to a reaction rate of 80–90 %, peeling strength of ~1 N/mm, and power loss of 1.2–3.3 %. Further, to analyze the effectiveness of the LT-CF process in preventing thermal stress in comparison to a conventional soldering ribbon (SR) process, the bows of LT-CF-bonded and conventional SR-bonded cells were compared. The average bow of the LT-CF-bonded cells (1.42 mm) was lower than that of the SR-bonded cells (3.15 mm), representing a bow suppression of 54.9 %
Authors and Affiliations
Keywords
Related Articles
- EP ID EP137379
- DOI -
- Views 70
- Downloads 0
A SIMPLE APPROACH TO DEFEND BLACKHOLE ATTACK IN MANETS
The interest in the field of Mobile Ad hoc Network (MANET) is growing since last few years because of its practical applications in mobile devices. MANET is particularly vulnerable to security attacks in comparison to...
Evaluation of DTN Routing Protocols
In Delay Tolerant Networking (DTN) data can transfer in challenging environments where a fully connected end to end path may never exist between a source and destination. These networks deal with large transmissio...
A Survey about Power Reduction in Intergated Circuits Using Multi-Bit Flip-Flops
— Power has become a burning issue in modern VLSI design. In modern integrated circuits, the power consumed by clocking gradually takes a dominant part. Given a design, we can reduce its power consumption by rep...
IMPROVING USER - TO - ROOT AND REMOTE - TO - LOCAL ATTACKS USING GROWING HIERARCHICAL SELF ORGANIZING MAP
Intrusion Detection System (IDS) protects a system by detecting “known” as well as “unknown” attacks and generates the alert for suspicious activities in the traffic. There are various approaches for IDS, but our surve...
Numerical Prediction of Weld Quality in Friction Stir Welding of Dissimilar Materials
Objective of this research is to develop a finite element simulation of friction stir welding of Magnesium and Titanium alloys. In the present study, the transient analysis is performed in Ansys to simulate the fr...