High Heat Flux Micro-Electronics Cooling
Journal Title: International Journal of Modern Engineering Research (IJMER) - Year 2013, Vol 3, Issue 1
Abstract
Abstract: The temperature of an electronics device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000W/cm2 in the near future. This paper study explored the benefit of cooling the electronics device using indirect refrigeration cooling system .In this system the heat sink in a primary pumped liquid loop, reject heat to a secondary refrigeration loop. It was being explored for two phase cooling of ultra high power electronic component .For effective and efficient thermal management of electronic systems active control methods desired to suppress inherent flow instability especially in transient applications. The inclusion of the vapor compression cycle in the two loop system elevates the temperature difference between the refrigerant and the ambient cooling media, resulting in increased system cooling capacity.
Authors and Affiliations
P. D. Giradkar
Keywords
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