Performance Analysis and Heat Transfer Studies on Protruding Surfaces of Electronic Components through Forced Convection
Journal Title: International Journal for Research in Applied Science and Engineering Technology (IJRASET) - Year 2017, Vol 5, Issue 2
Abstract
Electronics equipment has made inroads in almost every aspect of modern life from toys and appliances to high power computer. Every electronic component depends on the passage of electric current to perform its duty, and it becomes the potential site of heat generation (I2R). The continued miniaturization of electronic system has caused a drastic increase in the amount of heat generation per unit volume, which is comparable in magnitude to that in a reactor. This high rate of heat generation, unless controlled, jeopardizes the safety and reliability of the system. The failure rate of electronic component or equipment increases exponentially with temperature. The essence of thermal design of electronic components is the removal of internally generated heat to the surrounding medium. Several cooling techniques commonly used are conduction cooling, natural convection and radiation cooling, forced air cooling, liquid cooling, immersion cooling and heat pipes. In connection to the above in this project thermal system with efficient heat sinks (e.g., pin-finned heat exchangers) is to be analyze.
Authors and Affiliations
J. Vimalan, T. Senthil Raja, S. Sivan
Keywords
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- EP ID EP23197
- DOI http://doi.org/10.22214/ijraset.2017.2109
- Views 236
- Downloads 6
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