Thermal Design and Analysis of Mechanical Housing Using Ansys
Journal Title: International Journal of engineering Research and Applications - Year 2017, Vol 7, Issue 9
Abstract
Mechanical housing play critical role in ground electronic devices. It houses Printed Circuit Boards (PCBs) on which high heat dissipating components will be mounted. The complexity associated with this requirement is to dissipate the heat to the ambient through constrained heat path. Though heat can be dissipated to a greater extent through means of forced convection but it demands for power. Hence heat is to be dissipated through free convection in addition to conduction. Thermal design and analysis of mechanical housing in free convection environment is a tedious task in commercial FE software packages. Evolving a theoretical approach for thermal design and analysis of mechanical housing considering two basic heat dissipation mechanisms (Conduction and Free convection) has been taken up in this project. The outcome of the project would be a theoretical method using which the thermal designer can quickly design his mechanical housing. Proposed method also investigates whether enhanced cooling mechanism like fins is needed to be adopted or not and if so it enables the designer to formulate optimum design of fins. This method can be used for any size of the mechanical housing and for any heat dissipation rates and hence it offers a universal solution for thermal design. More over in this project the proposed theoretical method will be validated with thermal analysis of mechanical housing using Finite Element Method (FEM) in ANSYS software.
Authors and Affiliations
Mr. N. Venkatesh, Mr. M. Kedarnath
Keywords
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