The influence of heat treatment on properties of lead-free solders Journal title: Materials Engineering - Materialove inzinierstvo (MEMI) Authors: Lydia Rizekova, Marian Drienovsky, Katarina Pociskova, Milan Ozvold Subject(s):
Electromigration Microstructure and Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints Journal title: 河南科技大学学报(自然科学版) Authors: Mengmeng SUN, Keke ZHANG, Chao ZHANG, Ning MA, Huigai WANG Subject(s):
Effect of Powder Metallurgy on Microstructures and Mechanical Properties of Sn2.5Ag0.7Cu0.1RE Lead-free Solder Journal title: 河南科技大学学报(自然科学版) Authors: Meng ZHANG, Keke ZHANG, Fupeng HUO, Huigai WANG Subject(s):
Electromigration Behavior of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints under Thermal Cycling Journal title: 河南科技大学学报(自然科学版) Authors: Chao ZHANG, Keke ZHANG, Ning MA, Mengmeng SUN Subject(s):
Investigation of Microstructure and Creep Properties of Sn-xSb Solder Alloys up to Peritectic Composition Journal title: JOURNAL OF ADVANCES IN PHYSICS Authors: Amal Mohamed Yassin, Berlent Khalifa, Reda Ismail Subject(s):