Electromigration Microstructure and Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints
Journal Title: 河南科技大学学报（自然科学版） - Year 2018, Vol 39, Issue 2
Abstract
The effect of temperature on electromigration microstructure and properties of Sn2. 5 Ag0. 7 Cu 0. 1 RE/Cu solder joints was investigated. With the ambient temperature rising from 100 ℃ to 140 ℃, and the power on time extending from 24 h to 72 h, the cathodic intermetallic compound ( IMC) Cu6Sn5 became thinner, and the morphology was transformed from serrated to scallop. Meanwhile, the anodic IMC was gradually thickened, and the morphology was transformed from scallop to a raised hillock. Thin Cu3Sn layer was formed on the joint of parent metal. The increased thickness of the IMC on the anode side was larger than the decreased thickness of the IMC on the cathode side. The shear strength of Sn2. 5 Ag0. 7 Cu0. 1 RE/Cu solder joints was continually decreased. With the increase of temperature, the fracture mechanism of the shear fracture transforms from mixed fracture occurred in the brazing zone to brittle fracture occurred in the cathodic IMC layer.
Authors and Affiliations
Mengmeng SUN, Keke ZHANG, Chao ZHANG, Ning MA, Huigai WANG
Keywords
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