THE EFFECT OF REFLOW ON WETTABILITY OF Sn 96.5 Ag 3 Cu 0.5 SOLDER Journal title: Materials Engineering - Materialove inzinierstvo (MEMI) Authors: Zoltán Weltsch, József Hlinka Subject(s):
ON THE SPOT BRAZING AND SPOT SOLDERING OF TANTALUM Journal title: Academic Research International Authors: Fadhil , Raid , Mouahid Subject(s):
Zastosowanie logicznych drzew decyzyjnych do analizy wad w etapie lutowania na fali podczas montażu SMT Journal title: Zarządzanie Przedsiębiorstwem Authors: Milena Sadowińska Subject(s):
Ejection Performance of Coated Core Pins Intended for Application on High Pressure Die Casting Tools for Aluminium Alloys Processing Journal title: Tribology in Industry Authors: P. Terek, L. Kovačević, A. Miletić, D. Kukuruzović, B. Škorić Subject(s):
Optimization of the soldering process by the DMAIC methodology Journal title: Production Engineering Archives Authors: Michał Zasadzień Subject(s): Engineering, Educational Technology, Mechanical Engineering
Microstructure and Properties of Ni-rGO Reinforced Sn2.5Ag0.7Cu0.1RE Composite Soldering Joints Journal title: 河南科技大学学报（自然科学版） Authors: Fupeng HUO, Keke ZHANG, Meng ZHANG, Huigai WANG Subject(s):
Electromigration Behavior of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints under Thermal Cycling Journal title: 河南科技大学学报（自然科学版） Authors: Chao ZHANG, Keke ZHANG, Ning MA, Mengmeng SUN Subject(s):
Review on Soldering In Prosthodontics Journal title: IOSR Journal of Dental and Medical Sciences (IOSR-JDMS) Authors: Dr M Kanmani MDS, Dr J Gandimathi MDS, Dr.K.Vinayagavel MDS, Dr C Sabarigirinathan MDS, Dr Francilin... Subject(s):
RESEARCH OF MECHANICAL CHARACTERISTICS OF WELDED-SOLDERED THIN-WALLED STRUCTURES MADE OF HEAT RESISTANT MULTICOMPONENT ALLOYS Journal title: Вісник Кременчуцького національного університету імені Михайла Остроградського Authors: O. Salenko, V. Shchetynin, E. Lashko, О. Potapov Subject(s):
A Practical Learning Simulation Software with Specific Applications for Printed Circuit Board Soldering/De-soldering Ability Certifications Journal title: International Journal of Multidisciplinary Research and Analysis Authors: Chin-Ming Hsu, Chian-Yi Chao Subject(s): Biological Sciences, Economics, Education, Engineering, Mathematics, Social Sciences, Technological Change, Health science
Verification of the mathematical model of the induction soldering technological process Journal title: Modern Innovations, Systems and Technologies Authors: Vyacheslav Marayev Subject(s): Engineering, Environmental Sciences, Materials Science, Management Information Systems, Technological Change, Control Systems, Control and Optimization, Innovation
