Microstructure and Properties of Ni-rGO Reinforced Sn2.5Ag0.7Cu0.1RE Composite Soldering Joints
Journal Title: 河南科技大学学报（自然科学版） - Year 2019, Vol 40, Issue 2
Abstract
Nickel particle-decorated reduced graphene oxide ( Ni-r GO) reinforced Sn2. 5 Ag0. 7 Cu0. 1 RE composite solder was prepared via powder melting process. The microstructure and properties of Ni-r GO reinforced Sn2. 5 Ag0. 7 Cu0. 1 RE composite soldering joints were investigated by scanning electron microscope ( SEM) and X ray diffraction ( XRD) . The results show that the good soldering joints are obtained between Nir GO reinforced Sn2. 5 Ag0. 7 Cu0. 1 RE composite solder and Cu substrate. With 270 ℃ soldering temperature and 240 s soldering time, the maximum shear strength with 0. 05% Ni-r GO reaches to 29. 7 MPa, which is higher than that of Sn3. 0 Ag0. 5 Cu soldering joints. With the increase of soldering time, the fracture pattern transformes from ductile fracture dominated by dimples to ductile-brittle mixed fracture composed of dimples and cleavage. Besides, the fracture pathway moves from the transition zone which consisted of soldering seam and interfacial IMC to the interfacial IMC direction. The soldering seam is composed of β-Sn and eutectic structure, while the interfacial IMC layer consists of Cu6 Sn5 and new phase ( Cu, Ni) 6 Sn5. The thickness and roughness of interfacial IMC of Ni-r GO reinforced Sn2. 5 Ag0. 7 Cu0. 1 RE composite soldering joints are increased, and the microstructure of IMC transforms from scallops to sawtooth.
Authors and Affiliations
Fupeng HUO, Keke ZHANG, Meng ZHANG, Huigai WANG
Keywords
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- EP ID EP422465
- DOI 10.15926/j.cnki.issn1672-6871.2019.02.002
- Views 114
- Downloads 0
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