Semi-analytical solution of functionally graded circular short hollow cylinder subject to transient thermal loading
Journal Title: Archive of Mechanical Engineering - Year 2014, Vol 0, Issue 3
Abstract
In this paper, by using a semi-analytical solution based on multi-layered approach, the authors present the solutions of temperature, displacements, and transient thermal stresses in functionally graded circular hollow cylinders subjected to transient thermal boundary conditions. The cylinder has finite length and is subjected to axisymmetric thermal loads. It is assumed that the functionally graded circular hollow cylinder is composed of N fictitious layers and the properties of each layer are assumed to be homogeneous and isotropic. Time variations of the temperature, displacements, and stresses are obtained by employing series solving method for ordinary differential equation, Laplace transform techniques and a numerical Laplace inversion.
Authors and Affiliations
Jafar Jam, Y. Rahmati Nezhad
Keywords
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- EP ID EP166889
- DOI 10.2478/meceng-2014-0023
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